BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s numerous lasers are equipped to take care of volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It is the right approach to use when you can find sharp corners or many tight radii of curvature within the PCB Routing or perhaps in the flex circuit.

Depending on the material as well as the part requirements, BEST laser services gives a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. By using a laser to perform the depaneling allows the user the main advantage of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost with no cutting oils or another contaminants.

rigid flex depanelizedIn addition BEST can be that provider of laser depanelization in case you have plenty of IoT devices which should be precisely machined or remove to fit perfectly in to small mechanical enclosures.

Because of the contact-free processing that proceeds with PCB Laser Cutting Machine of printed circuit boards, there is very little distortion even when thin materials are used. When boards are milled or punched out utilizing a mechanical tool there may show to be a loss precision and potentially a distortion within the outside board dimensions. Even worse it could crack solder joints when working with these mechanical means. In BEST laser depanelization system feature fiducial registration and on-line scaling, which suggests already existing distortions can be compensated and also the cut contours positioned precisely throughout the layout.

Similar to scoring or v-grooves, laser perforations are an alternative for singulated board removal coming from a panel or sheet. Perforations might be laser formed to any size and spacing to meet the preferred removal and securement forces.

Laser scoring can create a limited depth ablation line from the panelized boards. Most of the time the depth from the score lines are 50% from the material thickness and may be controlled into a desired depth. The scoring acts in a manner like the hold-tab to secure the part from the panel or sheet, but enables individual 19dexjpky being ‘snapped’ out after processing. Laser scoring lines can also be used being a deliberate path for crack propagation or stress relief. When performing the score lines as a service BEST either can take advantage of the IPC guidelines or follow customer requirements.

Hold-in tabs are small uncut sections around the board which are employed to secure the FPC Punching Equipment inside the panel. The hold-in tabs are used for simplicity of handling small boards or printed circuit board securement for extra processing. The hold-in tab width is chosen based on the amount of force desired to remove the part from your panel/sheet or known forces to be applied by downstream processes like component loading. BEST laser services can cause tabs in the majority of board materials as well as to nearly any width and location about the part.